HIGH-THROUGHPUT DRAM TECHNOLOGY
Since the speed performance of the central processing unit(CPU) has been drastically increased, the DRAM is under pressure
to achieve fast response. A variety of useful approaches
are categorized according to three criteria: multibit data output,
high-frequency control clock, and advanced interface technology.
These approaches are selected with careful consideration
for cost-per-bit performance, which is the most important
factor for any type of memory chips. Figure 9 shows the recent
market for memory, according to speed performance and capacity.
Instead of common memory devices, several advanced apBL/
BL proaches, such as extended data out (EDO) DRAM, synchro-
nous DRAM (SDRAM), and Rambus DRAM (RDRAM), will
play main roles in the future memory market. Although the purpose
of new approaches is to achieve high data throughput,each
approach has unique features.

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